- Manufacturer:
-
- Aavid (37)
- Comair Rotron (8)
- CUI Devices (3)
- DFRobot (2)
- Radian (8)
- Seeed (2)
- T-Global Technology (23)
- Wakefield Thermal (21)
- Part Status:
-
- Type:
-
- Shape:
-
- Package Cooled:
-
- Attachment Method:
-
- Power Dissipation @ Temperature Rise:
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- Thermal Resistance @ Forced Air Flow:
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- Thermal Resistance @ Natural:
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127 Records
Image | Part | Manufacturer | Description | MOQ | Stock | Action | |
---|---|---|---|---|---|---|---|
OSEPP Electronics | RASPBERRY PI COP... |
1 |
18,633
In-stock
|
Get Quote | |||
T-Global Technology | PH3N NANO 50.8X12.70X... |
1 |
24,162
In-stock
|
Get Quote | |||
Aavid | BOARD LEVEL HEAT... |
1 |
14,368
In-stock
|
Get Quote | |||
Wakefield Thermal | HEATSINK FOR TO22... |
1 |
10,668
In-stock
|
Get Quote | |||
Aavid | BOARD LEVEL HEAT... |
1 |
11,045
In-stock
|
Get Quote | |||
T-Global Technology | PH3 101.6X25.4X0.21MM |
1 |
37,122
In-stock
|
Get Quote | |||
Aavid | BOARD LEVEL HEAT... |
1 |
36,270
In-stock
|
Get Quote | |||
T-Global Technology | PH3 76.2X12.07X0.21MM |
1 |
23,589
In-stock
|
Get Quote | |||
Wakefield Thermal | HEATSINK |
1 |
23,143
In-stock
|
Get Quote | |||
Aavid | BOARD LEVEL HEAT... |
1 |
10,785
In-stock
|
Get Quote | |||
Wakefield Thermal | BOARD LEVEL HEAT... |
1 |
48,179
In-stock
|
Get Quote | |||
Wakefield Thermal | HEATSINK ALUM BL... |
1 |
24,287
In-stock
|
Get Quote | |||
Wakefield Thermal | HEATSINK ALUM NA... |
1 |
25,755
In-stock
|
Get Quote | |||
T-Global Technology | PH3N NANO 76.2X19.1X0... |
1 |
40,422
In-stock
|
Get Quote | |||
T-Global Technology | PH3 50.8X12.07X0.21MM |
1 |
49,569
In-stock
|
Get Quote | |||
Wakefield Thermal | HEATSINK ALUM BL... |
1 |
47,258
In-stock
|
Get Quote | |||
CUI Devices | HEAT SINK TO-252 CO... |
1 |
21,128
In-stock
|
Get Quote | |||
T-Global Technology | PH3N NANO 76.2X19.1X0... |
1 |
47,933
In-stock
|
Get Quote | |||
Wakefield Thermal | HEATSINK ALUM NA... |
1 |
41,376
In-stock
|
Get Quote | |||
CUI Devices | HEAT SINK TO-263 CO... |
1 |
47,271
In-stock
|
Get Quote |