- Manufacturer：
-
- Aavid (1)
- CTS Corporation (229)
- CUI Devices (88)
- Ohmite (58)
- Seeed (3)
- Wakefield Thermal (91)
- WEC (4)
- Part Status：
-
- Type：
-
- Shape：
-
- Package Cooled：
-
- Attachment Method：
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- Power Dissipation @ Temperature Rise：
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- Thermal Resistance @ Forced Air Flow：
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- Thermal Resistance @ Natural：
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544 Records
| Image | Part | Manufacturer | Description | MOQ | Stock | Action | |
|---|---|---|---|---|---|---|---|
|
NTE Electronics, Inc. | CLIP-ON H/S FOR 40P... |
1 |
38,966
In-stock
|
Get Quote | ||
|
|
CUI Devices | HEAT SINK, EXTRUS... |
1 |
37,715
In-stock
|
Get Quote | ||
|
|
CUI Devices | HEAT SINK, EXTRUS... |
1 |
34,305
In-stock
|
Get Quote | ||
|
|
CUI Devices | HEAT SINK, EXTRUS... |
1 |
47,632
In-stock
|
Get Quote | ||
|
|
CUI Devices | HEAT SINK, EXTRUS... |
1 |
37,844
In-stock
|
Get Quote | ||
|
|
CUI Devices | HEAT SINK, EXTRUS... |
1 |
48,933
In-stock
|
Get Quote | ||
|
|
CUI Devices | HEAT SINK, EXTRUS... |
1 |
22,013
In-stock
|
Get Quote | ||
|
|
WEC | HEAT SINK, EXTRUS... |
1 |
46,918
In-stock
|
Get Quote | ||
|
|
CTS Corporation | HEATSINK FORGED ... |
1 |
48,183
In-stock
|
Get Quote | ||
|
|
CTS Corporation | HEATSINK FORGED ... |
1 |
28,598
In-stock
|
Get Quote | ||
|
|
CTS Corporation | HEATSINK FORGED ... |
1 |
10,856
In-stock
|
Get Quote | ||
|
|
ASSMANN WSW Components | HEATSINK CPU W/AD... |
1 |
13,983
In-stock
|
Get Quote | ||
|
|
CUI Devices | HEAT SINK, EXTRUS... |
1 |
18,587
In-stock
|
Get Quote | ||
|
|
CUI Devices | HEAT SINK, EXTRUS... |
1 |
13,247
In-stock
|
Get Quote | ||
|
|
CTS Corporation | HEATSINK FORGED ... |
1 |
21,333
In-stock
|
Get Quote | ||
|
|
CTS Corporation | HEATSINK FORGED ... |
1 |
11,421
In-stock
|
Get Quote | ||
|
|
CUI Devices | HEAT SINK, EXTRUS... |
1 |
27,537
In-stock
|
Get Quote | ||
|
|
CTS Corporation | HEATSINK FORGED ... |
1 |
16,606
In-stock
|
Get Quote | ||
|
|
CTS Corporation | HEATSINK FORGED ... |
1 |
37,720
In-stock
|
Get Quote | ||
|
|
CTS Corporation | HEATSINK FORGED ... |
1 |
18,567
In-stock
|
Get Quote |
