- Package Cooled：
-
- Attachment Method：
-
- Thermal Resistance @ Forced Air Flow：
-
- Thermal Resistance @ Natural：
-
5 Records
| Image | Part | Manufacturer | Description | MOQ | Stock | Action | |
|---|---|---|---|---|---|---|---|
|
CUI Devices | HEAT SINK, EXTRUS... |
1 |
30,035
In-stock
|
Get Quote | ||
|
|
CUI Devices | HEAT SINK, STAMPI... |
1 |
21,190
In-stock
|
Get Quote | ||
|
|
CUI Devices | HEAT SINK, BGA, 20 ... |
1 |
41,229
In-stock
|
Get Quote | ||
|
|
CUI Devices | HEAT SINK, BGA, 12 ... |
1 |
12,162
In-stock
|
Get Quote | ||
|
|
CUI Devices | HEAT SINK, BGA, 17 ... |
1 |
21,036
In-stock
|
Get Quote |
