- Manufacturer：
-
- CUI Devices (2)
- WEC (1)
- Material：
-
- Package Cooled：
-
- Attachment Method：
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- Thermal Resistance @ Forced Air Flow：
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- Thermal Resistance @ Natural：
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3 Records
| Image | Part | Manufacturer | Description | MOQ | Stock | Action | |
|---|---|---|---|---|---|---|---|
|
WEC | HEATSINK TO-220 4.7W... |
1 |
28,877
In-stock
|
Get Quote | ||
|
|
CUI Devices | HEAT SINK, EXTRUS... |
1 |
37,427
In-stock
|
Get Quote | ||
|
|
CUI Devices | HEATSINK TO-220 4.7W... |
1 |
46,960
In-stock
|
Get Quote |
