- Material：
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- Attachment Method：
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- Thermal Resistance @ Forced Air Flow：
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- Thermal Resistance @ Natural：
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5 Records
| Image | Part | Manufacturer | Description | MOQ | Stock | Action | |
|---|---|---|---|---|---|---|---|
|
CUI Devices | HEATSINK TO-220 4W ... |
1 |
11,467
In-stock
|
Get Quote | ||
|
|
CUI Devices | HEATSINK TO-220 4W ... |
1 |
12,405
In-stock
|
Get Quote | ||
|
|
CUI Devices | HEATSINK TO-220 4W ... |
1 |
22,010
In-stock
|
Get Quote | ||
|
|
CUI Devices | HEAT SINK, STAMPI... |
1 |
25,399
In-stock
|
Get Quote | ||
|
|
CUI Devices | HEATSINK TO-220 4W ... |
1 |
38,716
In-stock
|
Get Quote |
