- Material:
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- Type:
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- Package Cooled:
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- Attachment Method:
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- Thermal Resistance @ Forced Air Flow:
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- Thermal Resistance @ Natural:
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- Material Finish:
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3 Records
Image | Part | Manufacturer | Description | MOQ | Stock | Action | |
---|---|---|---|---|---|---|---|
CUI Devices | HEAT SINK TO-263 CO... |
1 |
42,157
In-stock
|
Get Quote | |||
CUI Devices | HEAT SINK, EXTRUS... |
1 |
18,181
In-stock
|
Get Quote | |||
CUI Devices | HEAT SINK, BGA, 27 ... |
1 |
36,838
In-stock
|
Get Quote |