- Package Cooled：
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- Attachment Method：
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- Power Dissipation @ Temperature Rise：
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- Thermal Resistance @ Natural：
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- Material Finish：
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| Image | Part | Manufacturer | Description | MOQ | Stock | Action | |
|---|---|---|---|---|---|---|---|
|
Advanced Thermal Solutions, Inc. | MAXIGRIP FANSINK... |
1 |
14,215
In-stock
|
Get Quote | ||
|
|
Advanced Thermal Solutions, Inc. | MAXIGRIP FANSINK... |
1 |
22,984
In-stock
|
Get Quote | ||
|
|
Aavid | BOARD LEVEL HEAT... |
1 |
33,777
In-stock
|
Get Quote | ||
|
|
Wakefield Thermal | ALUMINUM HEATSIN... |
1 |
13,863
In-stock
|
Get Quote | ||
|
|
Ohmite | HEATSINK TO-218,TO... |
1 |
48,686
In-stock
|
Get Quote | ||
|
|
Advanced Thermal Solutions, Inc. | MAXIGRIP FANSINK... |
1 |
13,048
In-stock
|
Get Quote | ||
|
|
Advanced Thermal Solutions, Inc. | MAXIGRIP FANSINK... |
1 |
23,124
In-stock
|
Get Quote | ||
|
|
Aavid | 63135 EXTRUSION 1.75X... |
1 |
38,096
In-stock
|
Get Quote | ||
|
|
Aavid | 62200 EXTRUSION 0.85X... |
1 |
13,715
In-stock
|
Get Quote |
