- Manufacturer：
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- CUI Devices (1)
- Package Cooled：
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- Attachment Method：
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- Power Dissipation @ Temperature Rise：
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- Thermal Resistance @ Natural：
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| Image | Part | Manufacturer | Description | MOQ | Stock | Action | |
|---|---|---|---|---|---|---|---|
|
CUI Devices | HEATSINK TO-220 3.2W... |
1 |
40,591
In-stock
|
Get Quote | ||
|
|
Wakefield Thermal | HEATSINK EXTRUSI... |
1 |
34,028
In-stock
|
Get Quote | ||
|
|
Advanced Thermal Solutions, Inc. | HEAT SINK 33MM X 33... |
1 |
36,156
In-stock
|
Get Quote | ||
|
|
Wakefield Thermal | HEATSINK 21X15MM F... |
1 |
30,775
In-stock
|
Get Quote | ||
|
|
Wakefield Thermal | HEATSINK 21X15MM S... |
1 |
36,800
In-stock
|
Get Quote | ||
|
|
Wakefield Thermal | HEATSINK 21X15MM D... |
1 |
32,241
In-stock
|
Get Quote | ||
|
|
Advanced Thermal Solutions, Inc. | HEATSINK 33X33X14.5M... |
1 |
23,237
In-stock
|
Get Quote |
