Manufacturer:
Package Cooled:
Attachment Method:
Power Dissipation @ Temperature Rise:
Thermal Resistance @ Natural:
Image Part Manufacturer Description MOQ Stock Action
HSE-B18508-0396H CUI Devices
HEAT SINK, EXTRUS...
1
RFQ
47,632
In-stock
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907-33-2-23-2-B-0 Wakefield Thermal
HEAT SINK PIN FIN...
1
RFQ
33,580
In-stock
Get Quote
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