- Part Status：
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- Material：
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- Type：
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- Package Cooled：
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- Attachment Method：
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- Power Dissipation @ Temperature Rise：
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- Thermal Resistance @ Natural：
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- Material Finish：
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10 Records
| Image | Part | Manufacturer | Description | MOQ | Stock | Action | |
|---|---|---|---|---|---|---|---|
|
Ohmite | HEATSINK D2PAK TO... |
1 |
48,232
In-stock
|
Get Quote | ||
|
|
Aavid | BOARD LEVEL HEAT... |
1 |
36,270
In-stock
|
Get Quote | ||
|
|
Ohmite | HEATSINK D2PAK TO... |
1 |
33,520
In-stock
|
Get Quote | ||
|
|
Wakefield Thermal | HEATSINK FOR 35MM... |
1 |
23,661
In-stock
|
Get Quote | ||
|
|
Wakefield Thermal | HEATSINK FOR 35MM... |
1 |
26,635
In-stock
|
Get Quote | ||
|
|
Wakefield Thermal | HEATSINK FOR 35MM... |
1 |
41,116
In-stock
|
Get Quote | ||
|
|
Wakefield Thermal | HEATSINK FOR 35MM... |
1 |
13,855
In-stock
|
Get Quote | ||
|
|
Ohmite | HEATSINK D2PAK TO... |
1 |
32,377
In-stock
|
Get Quote | ||
|
|
Ohmite | HEATSINK D2PAK TO... |
1 |
40,542
In-stock
|
Get Quote | ||
|
|
Wakefield Thermal | HEATSINK FOR 35MM... |
1 |
37,539
In-stock
|
Get Quote |
