- Manufacturer：
-
- CTS Corporation (3)
- CUI Devices (1)
- Type：
-
- Package Cooled：
-
- Attachment Method：
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- Power Dissipation @ Temperature Rise：
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- Thermal Resistance @ Natural：
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| Image | Part | Manufacturer | Description | MOQ | Stock | Action | |
|---|---|---|---|---|---|---|---|
|
CUI Devices | HEAT SINK, EXTRUS... |
1 |
37,844
In-stock
|
Get Quote | ||
|
|
CTS Corporation | HEATSINK FORGED ... |
1 |
15,694
In-stock
|
Get Quote | ||
|
|
CTS Corporation | HEATSINK FORGED ... |
1 |
43,816
In-stock
|
Get Quote | ||
|
|
CTS Corporation | HEATSINK FORGED ... |
1 |
36,525
In-stock
|
Get Quote |
