- Manufacturer：
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- CUI Devices (1)
- Part Status：
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- Material：
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- Shape：
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- Package Cooled：
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- Attachment Method：
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- Power Dissipation @ Temperature Rise：
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- Thermal Resistance @ Natural：
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- Material Finish：
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17 Records
| Image | Part | Manufacturer | Description | MOQ | Stock | Action | |
|---|---|---|---|---|---|---|---|
|
Wakefield Thermal | HEATSINK VERT MT... |
1 |
34,111
In-stock
|
Get Quote | ||
|
|
Wakefield Thermal | HEATSINK FOR TO22... |
1 |
24,099
In-stock
|
Get Quote | ||
|
|
Wakefield Thermal | HEATSINK TO-220 VE... |
1 |
13,918
In-stock
|
Get Quote | ||
|
|
TE Connectivity AMP Connectors | 27MM HS ASSY ULTEM... |
1 |
48,400
In-stock
|
Get Quote | ||
|
|
TE Connectivity AMP Connectors | 27MM LOW P HS ASSY... |
1 |
44,014
In-stock
|
Get Quote | ||
|
|
TE Connectivity AMP Connectors | 31MM HS ASSY ULTEM... |
1 |
39,127
In-stock
|
Get Quote | ||
|
|
Wakefield Thermal | HEATSINK FOR TO22... |
1 |
37,942
In-stock
|
Get Quote | ||
|
|
Advanced Thermal Solutions, Inc. | HEAT SINK 21MM X 21... |
1 |
24,109
In-stock
|
Get Quote | ||
|
|
Advanced Thermal Solutions, Inc. | SUPERGRIP HEATSI... |
1 |
10,582
In-stock
|
Get Quote | ||
|
|
Advanced Thermal Solutions, Inc. | HEAT SINK 37.6MM X ... |
1 |
17,545
In-stock
|
Get Quote | ||
|
|
CUI Devices | HEAT SINK, BGA, 27 ... |
1 |
36,838
In-stock
|
Get Quote | ||
|
|
Advanced Thermal Solutions, Inc. | HEAT SINK 23MM X 23... |
1 |
41,339
In-stock
|
Get Quote | ||
|
|
Advanced Thermal Solutions, Inc. | HEAT SINK 21MM X 21... |
1 |
46,100
In-stock
|
Get Quote | ||
|
|
Advanced Thermal Solutions, Inc. | HEATSINK 21X21X19.5M... |
1 |
17,846
In-stock
|
Get Quote | ||
|
|
Advanced Thermal Solutions, Inc. | HEATSINK 29X29X14.5M... |
1 |
14,800
In-stock
|
Get Quote | ||
|
|
Advanced Thermal Solutions, Inc. | HEATSINK 23X23X19.5M... |
1 |
28,336
In-stock
|
Get Quote | ||
|
|
Advanced Thermal Solutions, Inc. | HEAT SINK 29MM X 29... |
1 |
38,146
In-stock
|
Get Quote |
