- Manufacturer：
-
- CTS Corporation (1)
- CUI Devices (2)
- Part Status：
-
- Material：
-
- Package Cooled：
-
- Attachment Method：
-
- Power Dissipation @ Temperature Rise：
-
- Thermal Resistance @ Natural：
-
- Material Finish：
-
14 Records
| Image | Part | Manufacturer | Description | MOQ | Stock | Action | |
|---|---|---|---|---|---|---|---|
|
CTS Corporation | HEATSINK FORGED ... |
1 |
16,606
In-stock
|
Get Quote | ||
|
|
Wakefield Thermal | HEATSINK FOR TO21... |
1 |
13,518
In-stock
|
Get Quote | ||
|
|
Wakefield Thermal | HEATSINK TO-220 VE... |
1 |
46,015
In-stock
|
Get Quote | ||
|
|
Wakefield Thermal | HEATSINK FOR TO21... |
1 |
44,234
In-stock
|
Get Quote | ||
|
|
Wakefield Thermal | HEATSINK TO-220 W/S... |
1 |
12,482
In-stock
|
Get Quote | ||
|
|
Wakefield Thermal | HEATSINK TO-220 W/S... |
1 |
38,886
In-stock
|
Get Quote | ||
|
|
Advanced Thermal Solutions, Inc. | HEAT SINK 29MM X 29... |
1 |
44,870
In-stock
|
Get Quote | ||
|
|
CUI Devices | HEAT SINK TO-263 CO... |
1 |
42,157
In-stock
|
Get Quote | ||
|
|
Wakefield Thermal | HEATSINK TO-220 VR... |
1 |
33,346
In-stock
|
Get Quote | ||
|
|
Wakefield Thermal | HEATSINK 23X15MM F... |
1 |
32,529
In-stock
|
Get Quote | ||
|
|
CUI Devices | HEAT SINK, STAMPI... |
1 |
36,517
In-stock
|
Get Quote | ||
|
|
Wakefield Thermal | HEATSINK 23X15MM S... |
1 |
38,476
In-stock
|
Get Quote | ||
|
|
Wakefield Thermal | HEATSINK 23X15MM D... |
1 |
46,228
In-stock
|
Get Quote | ||
|
|
Advanced Thermal Solutions, Inc. | HEATSINK 29X29X19.5M... |
1 |
26,630
In-stock
|
Get Quote |
