- Manufacturer：
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- CUI Devices (1)
- Part Status：
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- Material：
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- Type：
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- Package Cooled：
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- Attachment Method：
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- Power Dissipation @ Temperature Rise：
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- Thermal Resistance @ Natural：
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| Image | Part | Manufacturer | Description | MOQ | Stock | Action | |
|---|---|---|---|---|---|---|---|
|
CUI Devices | HEAT SINK, EXTRUS... |
1 |
24,005
In-stock
|
Get Quote | ||
|
|
Wakefield Thermal | HEAT SINK ELLIP F... |
1 |
26,540
In-stock
|
Get Quote | ||
|
|
TE Connectivity AMP Connectors | 35MM LOW P HS ASSY... |
1 |
14,283
In-stock
|
Get Quote |
