- Manufacturer：
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- CUI Devices (1)
- Material：
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- Package Cooled：
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- Attachment Method：
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- Power Dissipation @ Temperature Rise：
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- Thermal Resistance @ Natural：
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- Material Finish：
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| Image | Part | Manufacturer | Description | MOQ | Stock | Action | |
|---|---|---|---|---|---|---|---|
|
CUI Devices | HEAT SINK, STAMPI... |
1 |
42,638
In-stock
|
Get Quote | ||
|
|
Advanced Thermal Solutions, Inc. | HEAT SINK 23MM X 23... |
1 |
38,251
In-stock
|
Get Quote | ||
|
|
Advanced Thermal Solutions, Inc. | SUPERGRIP HEATSI... |
1 |
12,653
In-stock
|
Get Quote | ||
|
|
Advanced Thermal Solutions, Inc. | HEAT SINK 23MM X 23... |
1 |
12,479
In-stock
|
Get Quote | ||
|
|
Advanced Thermal Solutions, Inc. | HEAT SINK 17MM X 17... |
1 |
30,647
In-stock
|
Get Quote | ||
|
|
Advanced Thermal Solutions, Inc. | HEATSINK 23X23X7.5M... |
1 |
14,630
In-stock
|
Get Quote |
