- Manufacturer:
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- CUI Devices (1)
- Part Status:
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- Material:
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- Package Cooled:
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- Attachment Method:
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- Power Dissipation @ Temperature Rise:
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- Thermal Resistance @ Natural:
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Image | Part | Manufacturer | Description | MOQ | Stock | Action | |
---|---|---|---|---|---|---|---|
Advanced Thermal Solutions, Inc. | HEATSINK TO-220 |
1 |
18,343
In-stock
|
Get Quote | |||
Advanced Thermal Solutions, Inc. | HEAT SINK 23MM X 23... |
1 |
22,552
In-stock
|
Get Quote | |||
CUI Devices | HEAT SINK, STAMPI... |
1 |
34,800
In-stock
|
Get Quote | |||
Advanced Thermal Solutions, Inc. | HEAT SINK 37.5 X 37.5... |
1 |
46,746
In-stock
|
Get Quote | |||
Advanced Thermal Solutions, Inc. | HEATSINK 37X37X14.5M... |
1 |
46,142
In-stock
|
Get Quote | |||
Advanced Thermal Solutions, Inc. | HEATSINK 23X23X24.5M... |
1 |
34,876
In-stock
|
Get Quote |