- Manufacturer：
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- CUI Devices (1)
- Material：
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- Package Cooled：
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- Attachment Method：
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- Power Dissipation @ Temperature Rise：
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- Thermal Resistance @ Natural：
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- Material Finish：
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10 Records
| Image | Part | Manufacturer | Description | MOQ | Stock | Action | |
|---|---|---|---|---|---|---|---|
|
Wakefield Thermal | HEATSINK 19X15MM S... |
1 |
38,078
In-stock
|
Get Quote | ||
|
|
Wakefield Thermal | HEATSINK 19X15MM F... |
1 |
36,972
In-stock
|
Get Quote | ||
|
|
Wakefield Thermal | HEATSINK 19X15MM D... |
1 |
14,582
In-stock
|
Get Quote | ||
|
|
Advanced Thermal Solutions, Inc. | HEATSINK AL6063 300X... |
1 |
24,724
In-stock
|
Get Quote | ||
|
|
CUI Devices | HEAT SINK, BGA, 23 ... |
1 |
36,617
In-stock
|
Get Quote | ||
|
|
Advanced Thermal Solutions, Inc. | HEATSINK TO-220 BL... |
1 |
33,490
In-stock
|
Get Quote | ||
|
|
Advanced Thermal Solutions, Inc. | HEATSINK AL6063 1220... |
1 |
33,982
In-stock
|
Get Quote | ||
|
|
Wakefield Thermal | HEATSINK 23X12MM F... |
1 |
45,399
In-stock
|
Get Quote | ||
|
|
Wakefield Thermal | HEATSINK 23X12MM S... |
1 |
49,775
In-stock
|
Get Quote | ||
|
|
Wakefield Thermal | HEATSINK 23X12MM D... |
1 |
38,279
In-stock
|
Get Quote |
