- Manufacturer：
-
- CTS Corporation (1)
- CUI Devices (1)
- Material：
-
- Type：
-
- Package Cooled：
-
- Attachment Method：
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- Power Dissipation @ Temperature Rise：
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- Thermal Resistance @ Forced Air Flow：
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5 Records
| Image | Part | Manufacturer | Description | MOQ | Stock | Action | |
|---|---|---|---|---|---|---|---|
|
CUI Devices | HEAT SINK, EXTRUS... |
1 |
47,769
In-stock
|
Get Quote | ||
|
|
Wakefield Thermal | HEAT SINK PIN FIN... |
1 |
11,457
In-stock
|
Get Quote | ||
|
|
Wakefield Thermal | HEAT SINK ELLIP F... |
1 |
10,741
In-stock
|
Get Quote | ||
|
|
CTS Corporation | HEATSINK FORGED ... |
1 |
44,615
In-stock
|
Get Quote | ||
|
|
Wakefield Thermal | HEAT SINK ELLIP F... |
1 |
21,506
In-stock
|
Get Quote |
