- Package Cooled：
-
- Attachment Method：
-
- Power Dissipation @ Temperature Rise：
-
- Thermal Resistance @ Forced Air Flow：
-
- Material Finish：
-
5 Records
| Image | Part | Manufacturer | Description | MOQ | Stock | Action | |
|---|---|---|---|---|---|---|---|
|
Aavid | BOARD LEVEL HEAT... |
1 |
25,292
In-stock
|
Get Quote | ||
|
|
Aavid | BOARD LEVEL HEAT... |
1 |
17,718
In-stock
|
Get Quote | ||
|
|
Aavid | BOARD LEVEL HEAT... |
1 |
34,325
In-stock
|
Get Quote | ||
|
|
Aavid | HEAT SINK |
1 |
35,083
In-stock
|
Get Quote | ||
|
|
Ohmite | HEATSINK AND CLI... |
1 |
31,831
In-stock
|
Get Quote |
