- Manufacturer：
-
- Aavid (1)
- CTS Corporation (1)
- CUI Devices (1)
- Ohmite (3)
- Part Status：
-
- Material：
-
- Package Cooled：
-
- Attachment Method：
-
- Power Dissipation @ Temperature Rise：
-
- Thermal Resistance @ Forced Air Flow：
-
- Material Finish：
-
6 Records
| Image | Part | Manufacturer | Description | MOQ | Stock | Action | |
|---|---|---|---|---|---|---|---|
|
Aavid | BOARD LEVEL HEAT... |
1 |
30,773
In-stock
|
Get Quote | ||
|
|
CUI Devices | HEATSINK HALF BR... |
1 |
17,251
In-stock
|
Get Quote | ||
|
|
Ohmite | ALUMINUM HEATSIN... |
1 |
49,302
In-stock
|
Get Quote | ||
|
|
CTS Corporation | HEATSINK PWR DUA... |
1 |
26,039
In-stock
|
Get Quote | ||
|
|
Ohmite | HEATSINK TO-218,TO... |
1 |
16,549
In-stock
|
Get Quote | ||
|
|
Ohmite | ALUMINUM HEATSIN... |
1 |
19,187
In-stock
|
Get Quote |
