- Manufacturer：
-
- Part Status：
-
- Package Cooled：
-
- Attachment Method：
-
- Power Dissipation @ Temperature Rise：
-
- Thermal Resistance @ Forced Air Flow：
-
- Material Finish：
-
7 Records
| Image | Part | Manufacturer | Description | MOQ | Stock | Action | |
|---|---|---|---|---|---|---|---|
|
Wakefield Thermal | HEATSINK MED HEX... |
1 |
39,419
In-stock
|
Get Quote | ||
|
|
Wakefield Thermal | HEATSINK NATURAL... |
1 |
38,249
In-stock
|
Get Quote | ||
|
|
Wakefield Thermal | HI-POWER HEATSIN... |
1 |
45,789
In-stock
|
Get Quote | ||
|
|
Apex Microtechnology | HEATSINK OPEN FR... |
1 |
13,976
In-stock
|
Get Quote | ||
|
|
Wakefield Thermal | 4.75X36" EXTRUSION 4... |
1 |
31,247
In-stock
|
Get Quote | ||
|
|
Wakefield Thermal | HI-POWER HEATSIN... |
1 |
46,805
In-stock
|
Get Quote | ||
|
|
Wakefield Thermal | 4.75X12" EXTRUSION 4... |
1 |
30,375
In-stock
|
Get Quote |
