- Material：
-
- Package Cooled：
-
- Attachment Method：
-
- Power Dissipation @ Temperature Rise：
-
- Thermal Resistance @ Forced Air Flow：
-
- Material Finish：
-
5 Records
| Image | Part | Manufacturer | Description | MOQ | Stock | Action | |
|---|---|---|---|---|---|---|---|
|
Aavid | BOARD LEVEL HEAT... |
1 |
28,828
In-stock
|
Get Quote | ||
|
|
Aavid | BOARD LEVEL HEAT... |
1 |
13,617
In-stock
|
Get Quote | ||
|
|
Ohmite | HEATSINK TO-218,TO... |
1 |
21,255
In-stock
|
Get Quote | ||
|
|
Ohmite | ALUMINUM HEATSIN... |
1 |
41,887
In-stock
|
Get Quote | ||
|
|
Ohmite | ALUMINUM HEATSIN... |
1 |
12,813
In-stock
|
Get Quote |
