- Manufacturer：
-
- Part Status：
-
- Package Cooled：
-
- Attachment Method：
-
- Thermal Resistance @ Forced Air Flow：
-
- Material Finish：
-
4 Records
| Image | Part | Manufacturer | Description | MOQ | Stock | Action | |
|---|---|---|---|---|---|---|---|
|
Apex Microtechnology | HEATSINK 8P TO-3 1.... |
1 |
48,197
In-stock
|
Get Quote | ||
|
|
Apex Microtechnology | HEATSINK 10P DIP |
1 |
10,526
In-stock
|
Get Quote | ||
|
|
Wakefield Thermal | 1.1WX12" EXTRUSI 1624... |
1 |
49,014
In-stock
|
Get Quote | ||
|
|
Wakefield Thermal | 1.1WX36" EXTRUSI 1624... |
1 |
12,616
In-stock
|
Get Quote |
