- Manufacturer：
-
- Ohmite (2)
- Package Cooled：
-
- Attachment Method：
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- Power Dissipation @ Temperature Rise：
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- Thermal Resistance @ Forced Air Flow：
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6 Records
| Image | Part | Manufacturer | Description | MOQ | Stock | Action | |
|---|---|---|---|---|---|---|---|
|
Advanced Thermal Solutions, Inc. | PCIE EXTRUSION P... |
1 |
48,427
In-stock
|
Get Quote | ||
|
|
Advanced Thermal Solutions, Inc. | PCIE EXTRUSION P... |
1 |
15,149
In-stock
|
Get Quote | ||
|
|
Ohmite | HEATSINK AND CLI... |
1 |
20,891
In-stock
|
Get Quote | ||
|
|
Advanced Thermal Solutions, Inc. | HEATSINK AL6063 300X... |
1 |
39,313
In-stock
|
Get Quote | ||
|
|
Advanced Thermal Solutions, Inc. | HEATSINK AL6063 1220... |
1 |
13,097
In-stock
|
Get Quote | ||
|
|
Ohmite | HEATSINK FOR TO-2... |
1 |
19,505
In-stock
|
Get Quote |
