- Package Cooled：
-
- Attachment Method：
-
- Power Dissipation @ Temperature Rise：
-
- Thermal Resistance @ Forced Air Flow：
-
- Thermal Resistance @ Natural：
-
7 Records
| Image | Part | Manufacturer | Description | MOQ | Stock | Action | |
|---|---|---|---|---|---|---|---|
|
Wakefield Thermal | HEATSINK EXTRUSI... |
1 |
35,283
In-stock
|
Get Quote | ||
|
|
Wakefield Thermal | HEATSINK EXTRUSI... |
1 |
32,289
In-stock
|
Get Quote | ||
|
|
Wakefield Thermal | HEATSINK EXTRUSI... |
1 |
16,451
In-stock
|
Get Quote | ||
|
|
Wakefield Thermal | HEATSINK ASSY FO... |
1 |
22,123
In-stock
|
Get Quote | ||
|
|
Wakefield Thermal | HI-POWER HEATSIN... |
1 |
45,789
In-stock
|
Get Quote | ||
|
|
Wakefield Thermal | HEATSINK EXTRUSI... |
1 |
47,863
In-stock
|
Get Quote | ||
|
|
Wakefield Thermal | HI-POWER HEATSIN... |
1 |
49,159
In-stock
|
Get Quote |
