SMDLTLFP250T5
- Manufacturer :
- Chip Quik, Inc.
- Product Category :
- Solder
- Composition :
- Bi57.6Sn42Ag0.4 (57.6/42/0.4)
- Diameter :
- -
- Flux Type :
- No-Clean
- Form :
- Jar, 8.8 oz (250g)
- Melting Point :
- 281°F (138°C)
- Mesh Type :
- 5
- Part Status :
- Active
- Process :
- Lead Free
- Shelf Life :
- 6 Months
- Shelf Life Start :
- Date of Manufacture
- Storage/Refrigeration Temperature :
- 37°F ~ 46°F (3°C ~ 8°C)
- Type :
- Solder Paste
- Wire Gauge :
- -
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| Qty | Unit Price | price |
|---|---|---|
| 1 | 132.95 | 132.95 |
| 10 | 126.3025 | 1263.025 |
| 100 | 119.655 | 11965.5 |
| 1000 | 118.3255 | 118325.5 |
| 10000 | 116.996 | 1169960 |
- Stock:
- 18,728
- Minimum Order:
- 1
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